Manipulating the adhesion of electroless plated Cu film on liquid polymer crystal substrate for advanced microelectronic manufacturing
Summary: The evolution from subtractive to modified semi-additive russian z flag for sale (mSAP) and semi-additive (SAP) processes has heightened the importance of electroless plated (ELP) copper (Cu) peel strength in the printed circuit board industry.This study introduces a wet process for depositing Cu on liquid crystal polymer (LCP) using advan